• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:

    公开号:SU890997A3
    申请号:SU782687105
    申请日:1978-11-20
    公开日:1981-12-15
    发明作者:Лозерт Эвальд；Рембольд Хайнц
    申请人:Циба-Гейги Аг (Фирма)；
    IPC主号:
    专利说明:

    The invention relates to microelectronics and can be used in the manufacture of printed circuits.
    In the manufacture of printed circuits with 5 through contact transitions from one side of the substrate to the other, it is advisable to apply a protective mask to the circuit before soldering. These protective masks solve the problem of protecting all parts of the circuit surface that should not have contact with solder during the soldering process, and thereby solve the problem of eliminating unwanted conductive jumpers between 16 printed conductors. At the same time, these lacquer masks act as an insulating layer for the finished circuit.
    Currently, high-resolution photoresists sensitive to ultraviolet rays are used to obtain protective masks.
    A known method of applying a dry film photoresist, which consists in pressing a film onto a substrate using a heated roller. This photoresist film is covered with negative, illuminated with ultraviolet rays, and then, having removed the negative, the corresponding developers remove the unexposed places by dissolution. As a result of this, a mask pattern arises with a clear structure £ 1].
    The disadvantage of this method is that it requires laborious technology for applying protective films to the surface of a printed circuit with good adhesion and without air bubbles. If even slight traces of moisture, air or other dusty contaminants remain between the film and the circuit, then during the subsequent soldering process, the appearance of bubbles and peeling of the protective mask are observed.
    Closest to the proposed technical solution is the method. applying a photoresist to a substrate based on irrigation of a photosensitive solution in the form of a freely falling stream onto a moving substrate at a flow rate of 60160 m / min [2].
    However, under the conditions used, it is impossible to obtain a high-quality coating and at the same time avoid blocking the holes with liquid photoresist when it is watered on a substrate.
    The purpose of the invention is to improve the quality of the coating and reduce clogging of the holes with a photoresist.
    This goal is achieved by the fact that according to the method of applying a photoresist on a substrate of a printed circuit with holes, based on the irrigation of a solution of a photoresist in the form of a freely falling stream on a moving substrate at a speed of incidence of the flow on the substrate of 60-160 m / min, a solution of photoresist with viscosity is used when watering 500-1200 MPa-s.
    The temperature of the photoresist solution is at least 20 ° C higher than the temperature of the substrate of the printed circuit.
    The solution of the photoresist in the form of a freely falling stream is applied to the substrate transported through this stream, and, firstly, the viscosity of the liquid substance is controlled so that it drops to 500-1200 mPa.s, preferably 600-900 mPa, upon falling onto the substrate of the printed circuit. c, secondly, the height of the flow is set such that its speed when falling onto the substrate is about 60-160 m / min, preferably 70-120 m / min, and thirdly, the speed of transportation of the substrate is chosen equal to or. slightly less, but preferably greater than the final flow rate.
    The drawing schematically shows an injection molding machine for implementing the method.
    The injection machine comprises an injection head 1 with a slot 2, a conveying device with two belt conveyors 3 and 4, a spare tank 5, a supply line 6, a pump 7, a discharge pipe 8 [the distance H between the head 1 and the conveyors 3 and 4 is preferably controlled by moving the head along the height, in the same way, in a wide range, the width of the slit 2, the pump capacity y and the speed of the conveyors or, accordingly, the speed of rotation of the motor driving them (not shown) are regulated! > substrate 9 of the printed circuit, photoresist solution stream 10, photoresist coating 11.
    The coated substrates 9 of the printed circuits are transported on belt conveyors 3 and 4 under the head 1. In this case, the photoresist solution emerging from the slit 2 freely flows with the flow of 10 onto the substrates and forms a thin coating 11 of the photoconductor on them. Since the substrates are very thin compared to the flow height, the distance between the head and the substrates is almost equal to the distance H between the head and the conveyor belts. The height of the flow and the speed of transportation can be chosen so that the coating of the photoresist appears in a high-quality protective mask. For the manufacture of a protective mask, an injection molding machine of the type shown by the company Burkle & Co., Machinenfabrik, Freudenstadt, ORG, model LZKL 400 is used.
    Example 1. A protective mask using this method of applying photoresist is made as follows. At an ambient temperature of approximately 25 ° C, the next 39% polymer solution, having a viscosity of about 750 mPa.s at room temperature, is loaded into an injection machine (tank 5). The composition of the solution includes 1500 g of a photosensitive epoxy resin with a molecular weight of 2000 and an epoxide content of 0.8-1.0 A unit / kg, 48 g of 2.6 xylyl biguanide, 1000 g of 1-acetoxy-2-ethoxyethane, 1300 g of ethylene glycol monomethyl ether, 3 g of dye.
    With a height of the injection head of 100 mm and a width of the injection gap of 0.6 mm, the rate of fall of the flow at its lower end is about 70-90 m / min. The conveyor speed is 130 m / min. The coated substrate of the printed circuit has a size of 210x300 mm and holes with a diameter of 0.8 mm. After coating, this board has a coating of photoresist weighing 6.10 g. After subsequent drying for 60 minutes at 80 ° C in a ventilated drying cabinet, the coating thickness on printed conductors 2 mm wide is 20-22 m. The holes are coated with a thin coating of photoresist only at their top edge. The printed circuits thus coated are illuminated through a photo mask 30 with a 5000-watt metal halide UV lamp and then developed in a cyclohexanone solution. Checking the holes, as well as the figure of the protective mask, shows that the holes are clean and the contours have high sharpness.
    After curing for 1 h at 130 ° C, a printed circuit coated with a mask is passed through a conventional solder wave at 2 ° C. After this procedure, the protective mask does not break, and the holes are filled with tin solder.
    Example 2. Substrates of printed circuit boards with a format of 400x550 mm and minimum conductive tracks with a width of 15
    300 microns, a height of 80 m at a distance of between 350 microns and the minimum diameters of openings of 0.8 mm coated with a layer of 37% strength solution of _ photoresist having a viscosity of 520 mPas. The 20 composition of the solution includes 5000 g of an epoxy-containing photopolymer with a molecular weight of about 2600 and an epoxide content of about 0.8 AED / kg, 160 g of o-toluylbiguanide, 5300 g of 1-ace ~ 2 $ toxi-2-ethoxyethane, 2500 g of monomethyl ether ethylene glycol, 2500 g of cyclohexanone.
    The substrates are degreased with 1,1,1-trichloroethane and dried at 80 ° C. The application of photoresist on heated substrates is carried out under the following conditions:
    Belt conveyor speed, m / min Solution flow height, mm Slit gap width, mm Drop rate on the substrate, m / min Weight of applied ^ layer is, g / m
    After drying the coating for 10 min and drying in an infrared oven at 80-120 C for 2 min, the solvent evaporates and, after cooling for 90 s, is applied to the other side of the substrate under the same conditions and dried. Photomasks are applied onto substrates coated with m made of photoresist · and a 5000 W metal halide lamp is illuminated for 45 s. Unlit areas of the coating are removed by dissolving cyclohexanone in a spray at a pressure of about 2.5 bar. After curing, substrates with protective masks made of photoresist are passed through a wave
    120 as
    120
    0.5
    About 100
    125 'solder at 2 ° C. The mask is not destroyed, the holes are filled with tin solder, which indicates that the printed contacts are free from photoresist.
    Π r and mer 3- For applying a photoresist on the substrates of printed circuits with a minimum distance between conductive tracks of 500 μm, a track thickness of 70 μm and a minimum hole diameter of 1.5 mm, a 42% photoresist solution is used. The composition of the solution with a viscosity of 1160 MPa * s at 24 ° C includes 5000 g of a photopolymer containing an epoxy group with a molecular weight of about 260 and an epoxide content of about 0.8 AED / kg, 160 g of o-toluylbiguanide, 3300 g of 1-acetoxy-2- ethoxyethane, 2500 g of ethylene glycol monomethyl ether, 1200 g of cyclohexanone, 10 g of diaerer substance.
    The photoresist is applied under the following conditions:
    The speed of the belt con- g Weier, m / min 110
    Lacquer drop height, mm 12 Slit gap width, mm 0.6
    The rate of fall of the stream when falling onto the substrate, m / min 100-120
    The weight of the applied layer was, g / m ^ · 130
    After 10 minutes exposure, the substrates of printed circuits coated with a photoresist are dried in a continuous furnace at 100-120 ° C for 90 s. After cooling for 90 s, the photoresist is applied to the other side of the substrate. Further processing (exposure, development, drying) is carried out as in example 2.
    Since only a small amount of the photoresist solution is poured into the holes, after exposure it is possible to qualitatively develop a protective mask and at the same time remove all residual resin from the holes.
    权利要求:
    Claims (2)
    [1]
    solution in the form of a free-flowing stream on a moving substrate at a flow rate of 60160 m / min2. However, with the modes used, it is not possible to obtain a high-quality coating and at the same time avoid plugging holes with a liquid photoresist when it is watered onto the substrate. The purpose of the invention is to improve the quality of the coating and reduce the blocking of the holes by the photoresist. This goal is achieved by the fact that according to the method of applying a photoresist on a substrate of a printed circuit with holes, based on irrigating the photoresist solution in the form of a free-flowing stream on a moving substrate, at a rate of falling on a substrate 60-100 m / min, during irrigation photoresist solution with a viscosity of 500-1200 mPa-s. The temperature of the photoresist solution is at least 20 ° C higher than the temperature of the printed circuit substrate. The photoresist solution in the form of a free-flowing stream is superimposed on the substrate transported through this stream, and, firstly, the viscosity of the liquid substance is adjusted so that it falls on the substrate of the printed circuit to be 500-1200 mPa-s, preferably 600-900 mPa-s, at first, the flow height is set such that its speed when falling on the substrate is about 60-160 m / m, preferably 70-120 m / min, and third, the transport speed of the substrate is chosen to be equal to or. somewhat less, but preferably more than the final flow rate. The drawing schematically shows an injection molding machine for carrying out the method. The injection molding machine contains a molding head 1 with a slit 2, a transport device with two belt conveyors 3 and a spare tank 5. a supply line 6, a pump 7, a discharge pipe 8, a distance H between the head 1 and the conveyors 3 and is preferably adjusted by moving the head in height in the same way, the width of the slit 2, the capacity per pump and the speed of the conveyors or, respectively, the rotation speed of the motor driving them (not shown), the substrates 9 of the printed circuit, the flow of 1U are adjusted in wide Ranges photoresist target, coating 11 of photoresist. The coated substrates 9 of the printed circuits are transported on conveyor belts 3 and under the head 1. At the same time, the photoresist solution coming out of the slit 2 freely falls on the substrates with a stream 10 and forms a thin coating 11 of photoresist on them. Since the substrates are very thin compared to the flow height, the distance between the head and the substrates is almost equal to the distance H between the head and belt conveyors. The height of the flow and the speed of transportation can be chosen such that the coating of the photoresist is formed into a high-quality protective mask. For the manufacture of a protective mask, a casting mother of the type shown in the drawing of the type 1 meter of Bürkl and Co is used. , Maschinenfabrik, Freudenstadt, ORG, model LZKL AOO. Example 1. A protective mask using this method of applying a photoresist is manufactured as follows. At an ambient temperature of approximately 25 ° С, the following 39% polymer solution is loaded into the injection molding machine (capacity 5), having a viscosity of 750 mPa-s at room temperature. The solution contains 1500 g of photosensitive epoxy resin with a molecular weight of 2000 and an epoxide content of 0.8-1.0 A u / kg, g of 2.6 xylylbiguanide, 1000 g of 1-acetoxy-2-ethoxyethane, 1300 g of ethylene glycol monomethyl ether, 3 g dye. With a height of the molding head of 100 mm and a width of the molding gap of 0.6 mm, the velocity of the fall of the flow at its lower end is about 70-90 m / min. The conveyor speed is 130 m / min. The coated substrate of the printed circuit has a size of 210x300 mm and holes with a diameter of 0.8 mm. After coating, this board has a coating of photoresist weighing 6.10 g. After subsequent drying for 60 minutes at 80 ° C in a ventilated oven, the thickness of the coating on printed conductors 2 mm wide is 20-22 m. The holes are covered with a thin coating of photoresist only at their top edge. The printed circuits thus coated are exposed to light through a photomask 30 with a 500-watt metal halide lamp of ultraviolet radiation and then developed in a solution of cyclohexanone. Inspection of the holes, as well as the drawing of the face shield, shows that all over are clean and the contours have high sharpness. After curing for 1 hour, the masked printed circuit is passed through a regular solder wave at. After this procedure, the protective mask is not destroyed, and the holes are filled with tin solder. Example 2. Printed circuit substrates with a format of 400x550 mm and minimally conductive paths 300 microns wide, 80 microns high, with a distance of 350 microns between them and minimum openings 0, 8 mm are coated with a 37% photoresist solution with a viscosity of 520 mPa-s. The solution contains 5000 g of a photopolymer containing an epoxy group with a molecular weight of about 2 br and an epoxide content of about 0.8 Aedi / c 1 g of o-toluylbiguanide, 5300 g of 1-ac-to-2-ethoxyethane, 2500 g of ethylene glycol monoether, 2500 g cyclohexanone. Substrates degreased with 1,1,1-trichloroethane and dried at 80 ° C. Carrying out photoresist on heated substrates is carried out under the following conditions: Belt conveyor speed, m / min120 Solution flow height, mm120 Slot gap width, mm0.5 Flow rate on substrate, m / min About 10 The weight of the applied layer is g / m After drying the coating for 10 minutes and drying in an infrared oven at 80-120 for 2 minutes, the solvent evaporates and, after cooling for 90 seconds, is applied to the other side of the substrate under the same conditions and dried. Photomasks are applied onto substrates coated with photoresist and photomasks are applied for 5 seconds with a 5000 W metal halide lamp. The unlighted areas of the coating are removed by dissolving cyclohexanone in a sprayer at a pressure of about 2.5 bar. After curing the substrate with protective masks of photoresist is carried out through a wave of solder at 2 ° C. The mask is not destroyed, the holes are filled with tin solder, which indicates that the printed contacts are free of photoresist. EXAMPLE 3 To apply a photoresist to printed circuit substrates with a minimum distance between conductive paths of 500 µm, a path thickness of 70 µm and a minimum hole diameter and 1.5 mm, a k2% photoresist solution is used. The solution with a viscosity of 1160 mPa-s at 24 ° C contains 5000 g of a photopolymer containing an epoxy group with a molecular weight of about 2 W and an epoxide content of about 0.8 Aedi / kg, 1 W g of o-toluyl biguanide, 3300 g of 1-acetoxy- 2-ethoxyethane, 2500 g of ethylene glycol monomethyl ether, 1200 g of cyclohexanone, 10 g of a diaerone. The photoresist is applied under the following conditions: Belt conveyor speed, m / min110 Varnish drop height, mm12 Slot gap width, mm0.6 Flow rate when falling onto the substrate, m / min100-120 Applied layer weight, g / m 130 Substrates Printed circuits with photoresist after 10 minutes of exposure are dried in a continuous oven at 100-120 ° C for 90 s. After cooling for 90 seconds, the photoresist is applied to the other side of the substrate. Further processing (illumination, appearance, drying) is carried out as in Example 2. Since only a small amount of photoresist solution is poured into the holes, then after exposure to light, a protective mask can be made and all the resin residues removed from the holes. Claim 1. A method of applying a photoresist on a substrate of a printed circuit with holes, based on watering a photoresist solution in the form of a free-flowing stream of a moving substrate at a rate of falling flow on a substrate 60-1 m / min, characterized in that and reduce the blocking of the photoresist holes, while watering, use a photoresist solution with a viscosity of 500-1200 mPa-s. 2, a method according to claim 1, characterized in that the temperature of the photoresist solution is at least higher than the temperature of the substrate of the printed circuit. 89 8 Sources of information taken into account in the examination 1.Patent ShA No. 3883352, cl. 96-35.1, 1975.
    [2]
    2. Accepted for the Federal Republic of Germany “1928025, cl. G 03 C 1/7, 197 (prototype).
    类似技术:
    公开号 | 公开日 | 专利标题
    SU890997A3|1981-12-15|Method of coating photoresist on bed of printed circuit with holes
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    CN110769608A|2020-02-07|Method and equipment for quickly removing residual copper at two ends of COF substrate
    JPH04372113A|1992-12-25|Formation of circuit pattern
    同族专利:
    公开号 | 公开日
    CA1118530A|1982-02-16|
    ATA826878A|1981-12-15|
    EP0002040B1|1981-12-30|
    JPH0157516B2|1989-12-06|
    IL56000A|1980-12-31|
    IT7851961D0|1978-11-20|
    JPS5482073A|1979-06-29|
    ES475242A1|1979-04-16|
    US4230793B1|1994-06-14|
    IL56000D0|1979-01-31|
    EP0002040A1|1979-05-30|
    US4230793A|1980-10-28|
    IT1105948B|1985-11-11|
    DE2861486D1|1982-02-18|
    AT367943B|1982-08-10|
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    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    CH1418277|1977-11-21|
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